Mechanism of material removal in abrasive electrochemical multi-wire sawing of multi-crystalline silicon ingots into wafers
- 21 November 2016
- journal article
- research article
- Published by Springer Science and Business Media LLC in The International Journal of Advanced Manufacturing Technology
- Vol. 91 (1-4), 383-388
- https://doi.org/10.1007/s00170-016-9718-6
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51175259)
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