Advantages and new development of direct bonded copper substrates
- 1 March 2003
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 43 (3), 359-365
- https://doi.org/10.1016/s0026-2714(02)00343-8
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- DBC substrates as a base for power MCM'sPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002