Design of a modular micropump based on anodic bonding
- 1 September 1997
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 7 (3), 179-182
- https://doi.org/10.1088/0960-1317/7/3/026
Abstract
A simple and reliable technology for the fabrication of micromachined micropumps is presented. The assembling of different wafers to produce valves and cavities is usually the critical step regarding final yield. Our technology uses exclusively the well known anodic bonding technique for this purpose. The prospective performance of the devices has been evaluated by finite element methods and system level simulations.Keywords
This publication has 1 reference indexed in Scilit:
- Dynamic simulations of micropumpsJournal of Micromechanics and Microengineering, 1996