Through-thickness characterization of copper electrodeposit
- 1 August 1995
- journal article
- Published by Springer Science and Business Media LLC in Journal of Electronic Materials
- Vol. 24 (8), 927-933
- https://doi.org/10.1007/bf02652963
Abstract
No abstract availableKeywords
This publication has 18 references indexed in Scilit:
- The Role of Texture On The Reliability Of Aluminum Based InterconnectsMRS Proceedings, 1993
- X-Ray Diffraction Method for Monitoring of Texture Evolution in LayersMaterials Science Forum, 1993
- Microstructure and Mechanical Properties of Electroless Copper DepositsAnnual Review of Materials Science, 1991
- Texture Development in Thin Metallic FilmsTextures and Microstructures, 1991
- A structural study of a metastable BCC phase in AlMn alloys electrodeposited from molten saltsScripta Metallurgica, 1989
- TEM Observation of Microstructure in Sputtered Co-Cr FilmJapanese Journal of Applied Physics, 1985
- Nature unmirrored, epistemology naturalizedSynthese, 1983
- The microstructure and magnetic properties of electroplated cobalt film for perpendicular magnetic recordingIEEE Transactions on Magnetics, 1982
- Electrocrystallization of nickel coatings with 〈211〉 textureSurface Technology, 1981
- MECHANICAL PROPERTIES OF METALLIC FILMSSoviet Physics Uspekhi, 1969