Over-limiting Current and Control of Dendritic Growth by Surface Conduction in Nanopores
Open Access
- 14 November 2014
- journal article
- research article
- Published by Springer Science and Business Media LLC in Scientific Reports
- Vol. 4 (1), 7056
- https://doi.org/10.1038/srep07056
Abstract
Understanding over-limiting current (faster than diffusion) is a long-standing challenge in electrochemistry with applications in desalination and energy storage. Known mechanisms involve either chemical or hydrodynamic instabilities in unconfined electrolytes. Here, it is shown that over-limiting current can be sustained by surface conduction in nanopores, without any such instabilities, and used to control dendritic growth during electrodeposition. Copper electrodeposits are grown in anodized aluminum oxide membranes with polyelectrolyte coatings to modify the surface charge. At low currents, uniform electroplating occurs, unaffected by surface modification due to thin electric double layers, but the morphology changes dramatically above the limiting current. With negative surface charge, growth is enhanced along the nanopore surfaces, forming surface dendrites and nanotubes behind a deionization shock. With positive surface charge, dendrites avoid the surfaces and are either guided along the nanopore centers or blocked from penetrating the membrane.This publication has 69 references indexed in Scilit:
- Nonlinear dynamics of ion concentration polarization in porous media: The leaky membrane modelAIChE Journal, 2013
- Chaotic flow-based fuel cell built on counter-flow microfluidic network: Predicting the over-limiting current behaviorJournal of Power Sources, 2011
- Layer-by-layer assemblies in nanoporous templates: nano-organized design and applications of soft nanotechnologySoft Matter, 2011
- Direct Formation of Thin-Walled Palladium Nanotubes in Nanochannels under an Electrical PotentialChemistry of Materials, 2011
- Theory and experiments of concentration polarization and ion focusing at microchannel and nanochannel interfacesChemical Society Reviews, 2010
- The missing memristor foundNature, 2008
- Highly Efficient Direct Electrodeposition of Co−Cu Alloy Nanotubes in an Anodic Alumina TemplateThe Journal of Physical Chemistry C, 2008
- Lithographically patterned nanowire electrodepositionNature Materials, 2006
- Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of AdditiveJournal of the Electrochemical Society, 2001
- Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and ViasJournal of the Electrochemical Society, 1998