Internal structure of dense electrodeposits
- 1 May 2000
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review E
- Vol. 61 (5), 5452-5463
- https://doi.org/10.1103/physreve.61.5452
Abstract
We report experimental investigations of the structure of dense patterns obtained during electrochemical deposition of copper in thin cells. The deposit correlation function reveals the periodic structuration of the patterns but shows that the primary spacing is not steady during the growth and that moreover it is not simply related to the diffusion length. Another measurable quantity is the occupancy ratio of the fingers in the cell. Its variation as a function of the experimental parameters is interpreted from specific properties of electrochemical growth. The results are discussed with respect to the well-known behavior of cellular solidification fronts.Keywords
This publication has 73 references indexed in Scilit:
- Stability of densely branched growth in dissipative diffusion-controlled systemsPhysical Review E, 1996
- Dissipation, geometry, and the stability of the dense radial morphologyPhysical Review E, 1993
- Pattern formation in electrochemical depositionChemometrics and Intelligent Laboratory Systems, 1992
- Nonlinear Structures in Physical SystemsWoodward Conference, 1990
- Laplace- and diffusion-field-controlled growth in electrochemical depositionPhysical Review Letters, 1989
- Self-Similarity of Diffusion-Limited Aggregates and Electrodeposition ClustersPhysical Review Letters, 1988
- Stability of the dense radial morphology in diffusive pattern formationPhysical Review Letters, 1987
- Morphology and Microstructure in Electrochemical Deposition of ZincPhysical Review Letters, 1986
- Dendritic and Fractal Patterns in Electrolytic Metal DepositsPhysical Review Letters, 1986
- Fractal Structures of Zinc Metal Leaves Grown by ElectrodepositionPhysical Review Letters, 1984