A new method for preparation of direct bonding copper substrate on Al2O3
- 1 August 2007
- journal article
- research article
- Published by Elsevier BV in Materials Letters
- Vol. 61 (19-20), 4131-4133
- https://doi.org/10.1016/j.matlet.2007.01.036
Abstract
No abstract availableKeywords
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