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Phase-shifting analysis in moire´ interferometry and its applications in electronic packaging
Home
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Phase-shifting analysis in moire´ interferometry and its applications in electronic packaging
Phase-shifting analysis in moire´ interferometry and its applications in electronic packaging
XH
Xiaoyuan He
Xiaoyuan He
DZ
Daqing Zou
Daqing Zou
SL
Sheng Liu
Sheng Liu
YG
Yifan Guo
Yifan Guo
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1 May 1998
journal article
Published by
SPIE-Intl Soc Optical Eng
in
Optical Engineering
Vol. 37
(5)
,
1410
https://doi.org/10.1117/1.601657
Abstract
In layered materials and structures, it is essential to observe stress and strain concentrations, strain gradients, failure initiation and growth, and local microstructure evolution. In this study, an innovative phase-shifting technique is proposed, coupled with image-processing software, to investigate several interesting problems in electronic packaging. A window-based graphics interface for phase shifting in a moire´ interferometry system is introduced. The phase shifting is accomplished by driving the reference grating in the moire´ interferometry system with a low-voltage piezo stack. Three images obtained from three shifts and the original image are used to derive the phase diagram, which is used for displacement and strain calculations. Automatic fringe numbering is achieved by the phase shifting, which significantly simplifies the traditional fringe-counting and -ranking process. The strain calculation is also automatic, utilizing the space derivative of the displacement. A three-point bending beam is used for the demonstration. In addition, a power plastic IC package and a flip-chip package are selected to demonstrate the power of the system. A nanoscale deformation field is obtained for both the corner area and the flip-chip solder balls. ©
1998 Society of Photo-Optical Instrumentation Engineers.
Keywords
INTERFEROMETRY
PACKAGING
PHASE SHIFTING
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Open Access
Cited by 44 articles