New plating bath for electroless copper deposition on sputtered barrier layers
- 31 January 2000
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 50 (1-4), 441-447
- https://doi.org/10.1016/s0167-9317(99)00313-5
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Effect of Thin-Film Texture and Zirconium Diffusion on Reliability against Electromigration in Chemical-Vapor-Deposited Copper InterconnectsJapanese Journal of Applied Physics, 1998
- Multilevel interconnections for ULSI and GSI eraMaterials Science and Engineering: R: Reports, 1997