Evaluation of contact resistance for isotropic electrically conductive adhesives
- 1 May 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (2), 299-304
- https://doi.org/10.1109/96.386265
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- Solder replacementPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attachPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
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- Evaluation of contact resistance for isotropic electrically conductive adhesivesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
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- Palladium as a lead finish for surface mount integrated circuit packagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991