Fabrication Methods for High Aspect Ratio Microstructures
- 1 February 1997
- journal article
- research article
- Published by SAGE Publications in Journal of Intelligent Material Systems and Structures
- Vol. 8 (2), 173-176
- https://doi.org/10.1177/1045389x9700800207
Abstract
Two methods for fabricating high aspect ratio (depth/width) microstructures were developed and compared. The first method is a modified deep X-ray lithography process with thick negative resist. For preventing pattern collapse caused by surface tension while the rinse liquid is evaporated, some post-rinse drying processes were investigated. The second method is a directional etching of polyimide by 02 reactive ion etching (RIE). The advantage of the latter method is that the surface tension of liquids does not affect the microstructure in a dry atmosphere. In both methods, aspect ratio of 10 was achieved in polymer molds for electroplating at pattern width of 5,um without collapse.Keywords
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