Reduction of electromigration in gold thin films in the presence of hydrogen

Abstract

Electromigration lifetime experiments have been completed on Au thin-film interconnects (Au, 0.5 μm thick and 25 μm wide) in vacuum (5×10−8 Torr) and in both hydrogen (H2) and helium (He) ambients (10 Torr). Results show that electromigration is drastically suppressed in the H2 environment with a greater than tenfold increase in lifetime realized.