CMOS Process-Compatible High-Power Low-Leakage AlGaN/GaN MISHEMT on Silicon
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- 15 March 2012
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 33 (5), 667-669
- https://doi.org/10.1109/led.2012.2188016
Abstract
We report on a novel Au-free CMOS process-compatible process for AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors. The process starts from a 150-mm GaN-on-Si substrate with an embedded Si 3 N 4 /Al 2 O 3 bilayer gate dielectric, encapsulated by a high-temperature low-pressure chemical vapor deposited nitride layer. Power devices with a 20-mm gate width reach a maximum output current of 8 A, a breakdown voltage of 750 V, and a specific on-resistance R on, sp of 2.9 mΩ·cm 2 . The off-state drain leakage at 600 V is 7 μA. We show robust gate dielectrics with a large gate bias swing.Keywords
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