Interface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites
- 27 February 2011
- journal article
- Published by Elsevier BV in Scripta Materialia
- Vol. 64 (12), 1083-1086
- https://doi.org/10.1016/j.scriptamat.2011.02.025
Abstract
No abstract availableKeywords
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