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Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating
Home
Publications
Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating
Effect of Additives on Hole Filling Characteristics of Electroless Copper Plating
Zenglin Wang
Zenglin Wang
OY
Osamu Yaegashi
Osamu Yaegashi
HS
Hiroyuki Sakaue
Hiroyuki Sakaue
TT
Takayuki Takahagi
Takayuki Takahagi
SS
Shoso Shingubara
Shoso Shingubara
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8 October 2004
journal article
Published by
IOP Publishing
in
Japanese Journal of Applied Physics
Vol. 43
(10)
,
7000-7001
https://doi.org/10.1143/jjap.43.7000
Abstract
No abstract available
Keywords
COPPER PLATING
FILLING CHARACTERISTICS
ELECTROLESS COPPER
HOLE FILLING
ADDITIVES ON HOLE
Cited by 13 articles