We have developed novel hermetically sealed package with through-hole for the use in low-cost millimeter-wave applications. The package is available with specifications ranging from DC to 85 GHz. The insertion loss at feed-through of the package is less than 0.5 dB at 76 GHz. It is especially suitable for flip-chip MMICs. We have also developed 76 GHz flip-chip MMICs for automotive radar applications. A combination of flip-chip bonding technique and new package will provide a low cost millimeter-wave module. The MMIC modules have the following characteristics: The 76 GHz 4-stage amplifier has a gain of 22 dB. The frequency mixer with 1-stage amplifiers has a conversion loss of 2 dB. The 38/76 GHz frequency doublers with the 38 GHz 1-stage amplifier provide an output power of 0 dBm. The voltage-controlled oscillator provides an output power of 6 dBm. The 76 GHz SPDT switch has an insertion loss of 6 dB and an isolation of 15 dB.