Preparation of Integrated Passive Microwave Devices Through Inkjet Printing
- 1 September 2013
- journal article
- Published by IMAPS - International Microelectronics Assembly and Packaging Society in Additional Conferences (Device Packaging, Hitec, Hiten, & Cicmt)
- Vol. 2013 (CICMT), 000232-000239
- https://doi.org/10.4071/cicmt-2013-tha24