Performance and thermal behavior of wood plastic composite produced by nonmetals of pulverized waste printed circuit boards
- 3 March 2010
- journal article
- research article
- Published by Elsevier BV in Journal of Hazardous Materials
- Vol. 179 (1-3), 203-207
- https://doi.org/10.1016/j.jhazmat.2010.02.080
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- Wood plastic composites weathering: Visual appearance and chemical changesPolymer Degradation and Stability, 2008
- Dimensional stability and mechanical behaviour of wood–plastic composites based on recycled and virgin high-density polyethylene (HDPE)Composites Part B: Engineering, 2008
- Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compoundJournal of Hazardous Materials, 2008
- Separation and recovery of materials from scrap printed circuit boardsResources, Conservation and Recycling, 2007
- Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgyJournal of Hazardous Materials, 2006
- WEEE recovery strategies and the WEEE treatment status in ChinaJournal of Hazardous Materials, 2006
- Surface chemistry changes of weathered HDPE/wood-flour composites studied by XPS and FTIR spectroscopyPolymer Degradation and Stability, 2004
- Effect of processing method on surface and weathering characteristics of wood–flour/HDPE compositesJournal of Applied Polymer Science, 2004
- Fundamental aspects of wood as a component of thermoplastic compositesJournal of Vinyl and Additive Technology, 2003
- Mechanical properties of wood flake–polyethylene composites. Part I: effects of processing methods and matrix melt flow behaviourComposites Part A: Applied Science and Manufacturing, 2001