A 1024-element high-performance silicon tactile imager
- 6 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 01631918,p. 674-677
- https://doi.org/10.1109/iedm.1988.32903
Abstract
A 32-*32-element capacitive silicon tactile imager has been developed for use in precision robotics applications where high density and high resolution are important. The silicon chip measures 1.8 cm*1.7 cm and is organized in an X-Y matrix of 1024 capacitor elements on 0.5-mm centers. The process uses two boron diffusions (deep and shallow) followed by a silicon-to-glass electrostatic bonding step and subsequent unmasked wafer dissolution. This results in a thick center plate for the sense capacitor supported by thinner beams. A data acquisition system used with the device offers over 7-bit force resolution with a maximum operating force of about 1 gm/element.Keywords
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