Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
Open Access
- 1 January 2015
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 215, 299-308
- https://doi.org/10.1016/j.jmatprotec.2014.08.002
Abstract
No abstract availableKeywords
Funding Information
- UK Engineering and Physical Science Research Council as part of the Innovative Electronic Manufacturing Research Centre (IeMRC) (EP/H03014X/1)
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