A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration

Abstract

This paper presents an extensive literature review and assessment of corrosion failure mechanisms encountered during accelerated tests of microelectronic devices. The failure mechanism of primary emphasis is electrolytic metal migration. The metallurgies of interest are silver, gold, copper, and aluminum. Electrochemical investigations of dendritic growth are also reviewed. Mechanistic results from the electrochemical investigations are discussed in light of the empirical results of accelerated tests.