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Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions
Home
Publications
Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions
Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions
RP
Ravi Prasher
Ravi Prasher
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9 November 2005
journal article
Published by
Intel
in
Intel Technology Journal
Vol. 9
(4)
https://doi.org/10.1535/itj.0904.03
Abstract
Intel designs and builds the essential technologies that serve as the foundation for the world’s computing devices.
Keywords
THERMAL RESISTANCE
CHIP
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Open Access
Cited by 126 articles