Influence of the Chip Temperature on the Moisture Induced Failure Rate of Plastic Encapsulated Devices
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4), 537-543
- https://doi.org/10.1109/tchmt.1983.1136209
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- A New Cyclic Biased T.H.B. Test for Power Dissipating IC's8th Reliability Physics Symposium, 1979