Sputtering Pattern Distortions on Plane and Cylindrical Collectors Deposit Structure of Aluminium Pattern between 100 and 560°K
- 1 August 1968
- journal article
- research article
- Published by Taylor & Francis in Philosophical Magazine
- Vol. 18 (152), 269-280
- https://doi.org/10.1080/00318086.1968.11716230
Abstract
The position, shape and thickness of the spots of a sputtering pattern on a plane collector are sensitively dependent on the direction and the angular distribution functions of the emission from the crystal are strongly influenced by neighbouring sputtering deposits. Cylindrical collectors are advantageous for quantitative analysis. In all cases the pattern can be distorted by a shadowing effect due to crystal surface roughness, by nucleation and chemical reactions (e.g. oxidation) during deposition. Experimental results with aluminium, sputtered with 20 kev Ar ions are reported.Keywords
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