Combination of Thick‐Film Dielectric/Thin Film Conductor for FinePattern Formation of Multi‐Layer Substrate

Abstract

Presented in this paper is a realization of Multi‐Layer Substrate with 30 μm signal pattern width and 100 μm square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100 μm square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method.