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Tolerance analysis for three‐dimensional optoelectronic systems packaging
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Tolerance analysis for three‐dimensional optoelectronic systems packaging
Tolerance analysis for three‐dimensional optoelectronic systems packaging
VM
Valentin N. Morozov
Valentin N. Morozov
YL
Yung‐Cheng Lee
Yung‐Cheng Lee
JN
John A. Neff
John A. Neff
DO
D. O‘brien
D. O‘brien
TM
Timothy S. McLaren
Timothy S. McLaren
HZ
Haijun Zhou
Haijun Zhou
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1 July 1996
journal article
Published by
SPIE-Intl Soc Optical Eng
in
Optical Engineering
Vol. 35
(7)
,
2034-2044
https://doi.org/10.1117/1.600782
Abstract
A series of optoelectronic processing systems is under development at the Optoelectronic Computing System Center (OCSC) at the University of Colorado. The demonstrations consist of two facing optoelectronic modules that communicate with each other using bidirectional free‐space optical channels. An analysis of the fabrication tolerances required for correct operation of these systems is presented. An overview of the system and the techniques used for fabrication is given, along with the tolerances achieved in practice. A comparison with theoretical results indicates the critical alignments within the system. Methods to obtain the alignments required for larger systems are discussed. ©
1996 Society of Photo−Optical Instrumentation Engineers.
Keywords
THREE DIMENSIONAL
TOLERANCING
PACKAGING
FREE SPACE OPTICS
OPTOELECTRONICS
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Open Access
Cited by 13 articles