Dislocation structure and the effect of stacking-fault energy in high temperature creep of Cu-Al solid solutions

Abstract

Cu-Al solid solutions (containing 2·5, 5·5, 11 and 16 at. % Al) with different stacking-fault energies were subjected to high temperature creep tests and their dislocation structure was investigated by means of transmission electron microscopy. The comparison of the structures observed in different solid solutions resulted in the conclusion that at high temperatures their stacking-fault energies are probably less different than at low temperatures. The results of the dislocation density evaluation correspond with the macroscopic creep characteristics. The effect of the stacking-fault energy on the high temperature creep behaviour has been discussed.