Lateral self-diffusion and electromigration in thin metal films
- 1 February 1975
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 25 (2), 343-352
- https://doi.org/10.1016/0040-6090(75)90054-1
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Formation of vanadium silicides by the interactions of V with bare and oxidized Si wafersApplied Physics Letters, 1973
- Principles and applications of ion beam techniques for the analysis of solids and thin filmsThin Solid Films, 1973
- Electromigration in thin gold filmsJournal of Physics F: Metal Physics, 1973
- Quantitative measurements of the mass distribution in thin films during electrotransport experimentsThin Solid Films, 1972
- Electromigration Damage in Thin Films due to Grain Boundary Grooving ProcessesJournal of Applied Physics, 1971
- ON THE DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMSApplied Physics Letters, 1971
- Observation of Void Formation Induced by Electromigration in Metallic Films *,**Zeitschrift für Naturforschung A, 1971
- A UNIVERSAL MICROSECTIONING TECHNIQUE FOR DIFFUSIONApplied Physics Letters, 1970
- Electromigration in Thin Al FilmsJournal of Applied Physics, 1969
- Electrotransport in Thin Indium FilmsJournal of Applied Physics, 1968