Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring Boards
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4), 544-552
- https://doi.org/10.1109/tchmt.1983.1136203
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- The Effect of High Dissipation Components on the Solder Joints of Ceramic Chip Carriers Attached to Thick Film Alumina SubstratesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Analysis of Surface Mount Thermal and Thermal Stress PerformanceIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Low Expansivity Organic Substrate for Flip-Chip BondingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979