Grain-Boundary Diffusion

Abstract

The diffusion of nickel into grain boundaries of various tilt angles in copper bicrystals was studied. The concentration contours from the grain boundary and the lateral lattice diffusion were measured by means of electron‐probe microanalysis. The product of grain‐boundary width and diffusion coefficient were calculated, and comparisons were made with theoretical solutions. The grain‐boundary coefficient is concentration dependent above 3% nickel in a 45° tilt boundary. With lower tilt angles, the coefficient is concentration dependent above 0.5% nickel.