Heterostructure integrated thermionic coolers
- 1 September 1997
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 71 (9), 1234-1236
- https://doi.org/10.1063/1.119861
Abstract
Thermionic emission in heterostructures is proposed for integrated cooling of high power electronic and optoelectronic devices. This evaporative cooling is achieved by selective emission of hot electrons over a barrier layer from the cathode to the anode. It is shown that with available high electron mobility and low thermal conductivity materials, and with optimized conduction band offsets in heterostructures, single-stage room temperature cooling of up to 20°–40° over thicknesses of the order of microns is possible.Keywords
This publication has 9 references indexed in Scilit:
- Laser Cooling of a Solid by 16 K Starting from Room TemperaturePhysical Review Letters, 1997
- High thermoelectric figures of merit in PbTe quantum wellsJournal of Electronic Materials, 1996
- Experimental study of the effect of quantum-well structures on the thermoelectric figure of meritPhysical Review B, 1996
- Superlattice applications to thermoelectricityJournal of Applied Physics, 1995
- Effect of superlattice structure on the thermoelectric figure of meritPhysical Review B, 1995
- Thermoelectric figure of merit of superlatticesApplied Physics Letters, 1994
- Thermionic refrigerationJournal of Applied Physics, 1994
- Vacuum microelectronic devicesProceedings of the IEEE, 1994
- Quantum Cascade LaserScience, 1994