A comparison of the dimple spacing on intergranular creep fracture surfaces with the slip band spacing for copper
- 31 March 1980
- journal article
- Published by Elsevier in Scripta Metallurgica
- Vol. 14 (3), 365-368
- https://doi.org/10.1016/0036-9748(80)90360-9
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°CActa Metallurgica, 1972
- Cavity growth mechanisms during creepActa Metallurgica, 1966
- On the mechanism of intelcrystalline crackingActa Metallurgica, 1956
- A mechanism for the formation of intergranular cracks when boundary sliding occursActa Metallurgica, 1956
- Origin and Spacing of Slip BandsNature, 1941