Magnetic microscopy for ICs failure analysis : comparative case studies using SQUID, GMR and MTJ systems
- 26 October 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Advances in scanning SQUID microscopy for die-level and package-level fault isolationMicroelectronics Reliability, 2003
- Submicron electrical current density imaging of embedded microstructuresApplied Physics Letters, 2003
- Microstructures of magnetic tunneling junctionsJournal of Applied Physics, 2003