Ultrasound-assisted electroless deposition of copper onto and into microporous membranes for electromagnetic shielding
- 31 December 1994
- Vol. 35 (2), 430-432
- https://doi.org/10.1016/0032-3861(94)90714-5
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Novel cable shielding materials based on the impregnation of microporous membranes with inherently conducting polymersAdvanced Materials, 1993
- Electroless Copper Plating from Copper‐Glycerin Complex SolutionJournal of the Electrochemical Society, 1992
- Sonochemical Enhancement of Phenylacetate ElectrooxidationSynthetic Communications, 1990