Some problems and possible solutions for hybrid microcircuit reliability
- 29 February 1980
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 11 (1), 26-36
- https://doi.org/10.1016/s0026-2692(80)80210-2
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components (PEDs)Microelectronics Reliability, 1977
- Intermetallic formation in gold-aluminum systemsSolid-State Electronics, 1970