MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics
- 1 November 2001
- journal article
- Published by Elsevier in Experimental Thermal and Fluid Science
- Vol. 25 (5), 231-242
- https://doi.org/10.1016/s0894-1777(01)00071-1
Abstract
No abstract availableThis publication has 25 references indexed in Scilit:
- Local jet impingement boiling heat transferInternational Journal of Heat and Mass Transfer, 1996
- Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic ComponentsJournal of Electronic Packaging, 1994
- Correlating Equations for Impingement Cooling of Small Heat Sources With Multiple Circular Liquid JetsJournal of Heat Transfer, 1994
- Heat Transfer from Chips to Dielectric Coolant: Enhanced Pool Boiling Versus Jet-Impingement CoolingJournal of Enhanced Heat Transfer, 1994
- Liquid jet impingement heat transfer with or without boilingJournal of Thermal Science, 1993
- Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid JetsJournal of Heat Transfer, 1993
- Thermal Management of Electronic Components with Dielectric Liquids.JSME International Journal Series B, 1993
- Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric LiquidJournal of Heat Transfer, 1990
- Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat FluxJournal of Heat Transfer, 1988
- Heat and Mass Transfer between Impinging Gas Jets and Solid SurfacesPublished by Elsevier ,1977