The importance of material selection for flip chip on board assemblies
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Encapsulation Of Flip Chip StructuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Flip-chip solder bump fatigue life enhanced by polymer encapsulationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Chip-to-Package InterconnectionsPublished by Springer Nature ,1989