Simulation of hybrid power components: a new electrothermal model
- 2 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite ElementsActive and Passive Electronic Components, 1987
- Temperature behavior of insulated gate transistor characteristicsSolid-State Electronics, 1985