The microstructure of programmed n+p n+ polycrystalline silicon antifuses
- 1 June 1983
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 54 (6), 3278-3281
- https://doi.org/10.1063/1.332438
Abstract
The microstructure and programming mechanism of an electrically programmable antifuse is described. The device consists of n+pn+ junctions in polycrystalline silicon programmed by applying voltage pulses to the two n+ terminals. High voltage electron microscopy and optical microscopy reveal the micro‐structure of programmed antifuses. Devices with Al metallization can be programmed with a single long pulse. The final resistance is about 20Ω and a metallic aluminum spike is formed between the two contacts. With Al and TiW (barrier) metallization, programming occurs after a series of short pulses by migration of n+ dopant. This results in an ohmic contact between the two n+ regions with a final resistance of approximately 300Ω.Keywords
This publication has 4 references indexed in Scilit:
- The electromigration of liquid metal inclusions in SiJournal of Applied Physics, 1980
- A fault-tolerant 256K RAM fabricated with molybdenum-polysilicon technologyIEEE Journal of Solid-State Circuits, 1980
- High-speed droplet migration in siliconJournal of Applied Physics, 1976
- Filamentation in silicon-on-sapphire homogeneous thin filmsJournal of Applied Physics, 1973