A practical assessment of current plastic encapsulated microelectronic devices
- 1 April 1989
- journal article
- research article
- Published by Wiley in Quality and Reliability Engineering International
- Vol. 5 (2), 125-129
- https://doi.org/10.1002/qre.4680050206
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- The influence of climatic conditions on the reliability of electronic components in telephone exchangesQuality and Reliability Engineering International, 1987