A Moisture Protection Screening Test for Hybrid Circuit Encapsulants
- 1 December 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (4), 492-498
- https://doi.org/10.1109/tchmt.1981.1135817
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- New acceleration factors for temperature, humidity, bias testingIEEE Transactions on Electron Devices, 1979