Abstract
The authors report the use of rapid thermal reoxidized nitrided thin ( approximately 90-AA) gate oxides in BF/sub 2//sup +/-implanted polysilicon gated p-MOSFETs. Although lightly nitrided gate oxides are unable to block the boron penetration, reoxidized nitrided gate oxides are found to have excellent barrier properties against boron penetration. In addition, excellent electrical characteristics in terms of device subthreshold conduction and transconductance are illustrated.<>

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