Implantation of N+ ions in n‐type InxGa1−xN (0.37≤x≤1.0) produces maximum increases in sheet resistance of 50–100 times upon annealing in the range of 400–600 °C. The dominant deep state introduced by implantation and annealing have ionization energies of ∼0.35–0.39 eV and therefore are relatively high in the band gap of the InGaN. There was no evidence for chemical deep levels associated with the implanted N+ or F+. The implant isolation behavior of n‐type InGaN appears analogous to that of InP and InGaAs.