Thermal Desorption Spectroscopy and X-Ray Photoelectron Spectroscopy Study of CFx Layer Deposited on Si and SiO2
- 1 December 1994
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 33 (12S)
- https://doi.org/10.1143/jjap.33.7047
Abstract
Thermal reactions between a fluorocarbon ( CF x ) layer formed with C4F8 magnetomicrowave plasma and Si and SiO2 are studied by thermal desorption spectroscopy (TDS). Atomic compositions and core spectra of the CF x layer are measured by temperature-programmed X-ray photoelectron spectroscopy (TP-XPS) with concomitant desorption gas species analysis by quadrupole mass spectrometer. The TDS study reveals that the primary reaction products are SiF4 in Si and SiF4 and CO in SiO2, and F generated from the CF x layer is a primary reactive species contributing to the formation of the reaction products not only in Si but also in SiO2. The TP-XPS study reveals that the drastic decrease of F/C ratio agrees with the desorption of SiF4 and CO.Keywords
This publication has 13 references indexed in Scilit:
- Fine Contact Hole Etching in Magneto-Microwave PlasmaJapanese Journal of Applied Physics, 1994
- etching of Si(111): The geometric structure of the reaction layerPhysical Review B, 1993
- Thermal Desorption Studies of Phosphorus‐Doped Spin‐on‐Glass FilmsJournal of the Electrochemical Society, 1992
- Chemical reaction dynamics of F atom reaction with the dimer reconstructed Si{100}(2×1) surfaceJournal of Vacuum Science & Technology A, 1990
- Fluorine-silicon reactions and the etching of crystalline siliconPhysical Review Letters, 1988
- Investigation of Reactive‐Ion‐Etching‐Related Fluorocarbon Film Deposition onto Silicon and a New Method for Surface Residue RemovalJournal of the Electrochemical Society, 1986
- Plasma-assisted etching mechanisms: The implications of reaction probability and halogen coverageJournal of Vacuum Science & Technology B, 1985
- Chemical sputtering of fluorinated siliconPhysical Review B, 1981
- A study of dry etching-related contaminations on Si and SiOSurface Science, 1979
- Plasma etching—A discussion of mechanismsJournal of Vacuum Science and Technology, 1979