High aspect ratio quarter-micron electroless copper integrated technology
Open Access
- 1 November 1997
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 37-38, 77-88
- https://doi.org/10.1016/s0167-9317(97)00096-8
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- A Novel Seed Layer Scheme to Protect Catalytic Surfaces for Electroless DepositionJournal of the Electrochemical Society, 1996
- Electroless copper deposition for ULSIThin Solid Films, 1995
- 100 nm wide copper lines made by selective electroless depositionJournal of Micromechanics and Microengineering, 1991
- Selective electroless copper for VLSI interconnectionIEEE Electron Device Letters, 1989