A multilayered package technology for MMICs
- 30 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1013-1016 vol.2
- https://doi.org/10.1109/aps.1993.385177
Abstract
Three packaging technologies are introduced. An MCF (multilayer ceramic frame) single-cavity package shows high performance to Ka-band. An advanced MCF multiple-cavity package exhibits high performance of 26 GHz receiver. A microwave MCM (multichip module) made of BAS substrate demonstrates high performance of the L-band amplifier.<>Keywords
This publication has 2 references indexed in Scilit:
- 26 GHz-band full MMIC transmitters and receivers using a uniplanar techniquePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 0.5-23 GHz MMIC amplifier modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002