Diffusion induced grain boundary migration in Au Cu and Au Ag thin films
- 30 April 1982
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 30 (4), 861-870
- https://doi.org/10.1016/0001-6160(82)90084-0
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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