Thin silicon device technology

Abstract

Conventional silicon slices can be mechanically thinned, reproducibly, to a thickness of 10±1 μm over areas of 4 cm diameter. Silicon slices of this thickness are quite flexible and can be handled with normal care. They are transparent in the red region of the visible spectrum, which facilitates the monitoring of thickness. Diode structures can be made in this material, either before or after thinning. The device technology which has evolved is explained. Some electrical results of thin silicon diodes together with some possible applications are presented.