Rankings
Publications
Search Publications
Cited-By Search
Sources
Publishers
Scholars
Scholars
Top Cited Scholars
Organizations
About
Login
Register
Home
Publications
Low k, Porous Methyl Silsesquioxane and Spin-On-Glass
Home
Publications
Low k, Porous Methyl Silsesquioxane and Spin-On-Glass
Low k, Porous Methyl Silsesquioxane and Spin-On-Glass
AK
Abbe T. Kohl
Abbe T. Kohl
RM
Richard Mimna
Richard Mimna
RS
Robert Shick
Robert Shick
LR
Larry Rhodes
Larry Rhodes
Z. L. Wang
Z. L. Wang
Paul A. Kohl
Paul A. Kohl
Open Access
Publisher Website
Google Scholar
Add to library
Cite
Download
Share
Download
Download
Download PDF
Download
1 January 1999
journal article
Published by
The Electrochemical Society
in
Electrochemical and Solid-State Letters
Vol. 2
(2)
,
77-79
https://doi.org/10.1149/1.1390740
Abstract
Low dielectric constant, porous silica was made from commercially available methyl silsesquioxane (MSQ) by the addition of a sacrificial polymer, substituted norbornene polymer containing triethoxysilyl groups (NB), to the MSQ. The silsesquioxane‐NB polymer film mixture was thermally cured followed by decomposition of the NB at temperatures above . The dielectric constant of the MSQ was lowered from 2.7 to 2.3 by creating pores in the MSQ. The voids created in the MSQ exhibited a closed‐pore structure. The concentration of NB in the MSQ affected the number of pores but not their size. Porous films were also created in a methyl siloxane spin‐on‐glass and its dielectric constant was lowered from 3.1 to 2.7. Infrared spectroscopy was used to follow the curing of the MSQ and decomposition of the NB. ©1999 The Electrochemical Society
Keywords
METHYL SILSESQUIOXANE
DIELECTRIC CONSTANT
SPIN
STRUCTURE
POROUS
PORES
All Articles
Open Access
Cited by 91 articles