Abstract
Microstructural changes in thick, continuous (001) films of copper have been studied by electron microscopy. Lamellar twins formed during the discontinuous growth stage were completely eliminated when the total deposit thickness had reached about 4000 Å. It was found that motion of the twins was inhibited during the initial stages of growth of the continuous deposit by surface irregularities in the form of grooves. The results are interpreted in terms of the diffusion-controlled mobility of incoherent twin boundaries and it is shown that this interpretation is in good agreement with experiment.